Accompanying the (re)design of products with environmental assessment (DfE) on the example of ADSM

N. Warburg, C. Herrmann, J. Chiodo
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引用次数: 11

Abstract

Supporting the industry in the design process, the approach described in this paper provides a real design for environment (DfE), including cost aspects. The basis for this form of DfE are the experiences and the data gained in numberless life cycle assessment (LCA) and life cycle engineering (LCE) studies as well as know how in applying generic modeling, simulations and scenario analysis. The method of life cycle costing (LCC) helps to implement economic aspects, which are often the main important aspects in industrial decision making. The goal is to bring environmental and economic considerations in harmony in respect to a sustainable development. LCE/LCA data and experiences shall be used for DfE to objectify the results, by using these scientific proven methods. It is applied and further developed on examples within the 'active disassembly using smart materials' (ADSM) project. The goals of this project are the demonstration of the feasibility of providing a nondestructive, cost effective, self-disassembly system for industry with the smart material device. Within the consumer electronics sector, existing state of the art products without smart materials are analyzed using LCA and LCC. A subsequent analysis with redesigned products consisting of embedded 'shape memory alloy' (SMA) and 'shape memory polymers' (SMP) devices is conducted. As a final stage the analysis is completed with assessed results and will be included in the activity of redesign for further product development.
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以ADSM为例,结合产品环境评价(DfE)进行(重新)设计
在设计过程中支持行业,本文中描述的方法提供了一个真正的环境设计(DfE),包括成本方面。这种形式的DfE的基础是在无数生命周期评估(LCA)和生命周期工程(LCE)研究中获得的经验和数据,以及如何应用通用建模、模拟和情景分析的知识。生命周期成本计算方法(LCC)有助于实现经济方面,这往往是工业决策的主要重要方面。目标是在可持续发展方面协调环境和经济方面的考虑。LCE/LCA数据和经验为DfE提供了客观的结果,通过使用这些经过科学验证的方法。它在“智能材料主动拆卸”(ADSM)项目的实例中得到了应用和进一步发展。该项目的目标是证明为工业提供一种具有智能材料设备的无损、经济、自拆卸系统的可行性。在消费电子领域,使用LCA和LCC分析没有智能材料的现有最先进产品。随后对由嵌入式“形状记忆合金”(SMA)和“形状记忆聚合物”(SMP)器件组成的重新设计的产品进行了分析。作为最后阶段,分析工作已完成,评估结果将包括在为进一步产品开发而重新设计的活动中。
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