Phase change memory: electrical circuit modelling, nanocrossbar performance analysis and applications

N. El-Hassan, T. N. Kumar, H. Almurib
{"title":"Phase change memory: electrical circuit modelling, nanocrossbar performance analysis and applications","authors":"N. El-Hassan, T. N. Kumar, H. Almurib","doi":"10.1049/pbcs073g_ch13","DOIUrl":null,"url":null,"abstract":"Phase change memory (PCM) functions by thermally induced phase change of chalcogenide material, typically from disordered highly resistive amorphous phase with short range atomic order and low free electron density, to a low resistance crystalline phase with long range atomic order and high free electron density, or vice versa [1,2]. PCM is one of the potential emerging nonvolatile memory (NVM) technologies to replace flash memory and be the technology for storage class memory due to its desirable properties such as short access time, long data retention, high endurance, scalability, CMOS compatibility and multibit storage [3-8]. Hence it is time to have an accurate electrical model of the PCM in order to realise a straightforward and timely implementation of PCM in an integrated circuit. This chapter presents the electrical circuit model of multibit PCM cell that accurately simulates the temperature profile, the crystalline fraction and the resistance of the cell as a function of the programming pulse. Also, the precise modelling of the drift phenomenon of resistance and threshold voltage at the amorphous phase is presented. The presented model's I-V characteristics are correlated with experimental data to demonstrate the validity of the developed PCM model. Next this chapter presents the analysis of PCM cells on a nanocrossbar as a memory system. The effect of connecting wires resistance in the performance of the PCM array structure, the amount of energy lost across each PCM cell and programmed state of the PCM cell is also discussed. It has been shown that the energy consumed in connecting wires decreases the power supplied to PCM cells thus resulting in higher programmed low resistive state (Rcrystalline). Additionally, methods to mitigate the programmedRcrystalline reliability issue are discussed in detail. Finally, the chapter concludes with the discussion on PCM-based memory application in implementing a logic function using the look-up-table (LUT), that is, PCM-based LUTs.","PeriodicalId":417544,"journal":{"name":"VLSI and Post-CMOS Electronics. Volume 2: Devices, circuits and interconnects","volume":"5 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"VLSI and Post-CMOS Electronics. Volume 2: Devices, circuits and interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1049/pbcs073g_ch13","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Phase change memory (PCM) functions by thermally induced phase change of chalcogenide material, typically from disordered highly resistive amorphous phase with short range atomic order and low free electron density, to a low resistance crystalline phase with long range atomic order and high free electron density, or vice versa [1,2]. PCM is one of the potential emerging nonvolatile memory (NVM) technologies to replace flash memory and be the technology for storage class memory due to its desirable properties such as short access time, long data retention, high endurance, scalability, CMOS compatibility and multibit storage [3-8]. Hence it is time to have an accurate electrical model of the PCM in order to realise a straightforward and timely implementation of PCM in an integrated circuit. This chapter presents the electrical circuit model of multibit PCM cell that accurately simulates the temperature profile, the crystalline fraction and the resistance of the cell as a function of the programming pulse. Also, the precise modelling of the drift phenomenon of resistance and threshold voltage at the amorphous phase is presented. The presented model's I-V characteristics are correlated with experimental data to demonstrate the validity of the developed PCM model. Next this chapter presents the analysis of PCM cells on a nanocrossbar as a memory system. The effect of connecting wires resistance in the performance of the PCM array structure, the amount of energy lost across each PCM cell and programmed state of the PCM cell is also discussed. It has been shown that the energy consumed in connecting wires decreases the power supplied to PCM cells thus resulting in higher programmed low resistive state (Rcrystalline). Additionally, methods to mitigate the programmedRcrystalline reliability issue are discussed in detail. Finally, the chapter concludes with the discussion on PCM-based memory application in implementing a logic function using the look-up-table (LUT), that is, PCM-based LUTs.
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相变存储器:电路建模、纳米横棒性能分析及应用
相变记忆(PCM)是通过硫系材料的热诱导相变来实现的,通常是由无序的、具有短范围原子有序和低自由电子密度的高电阻非晶相转变为具有长范围原子有序和高自由电子密度的低电阻结晶相,反之亦然[1,2]。PCM具有访问时间短、数据保留时间长、耐用性高、可扩展性强、CMOS兼容和多比特存储等优点,是潜在的新兴非易失性存储器(NVM)技术之一,有望取代闪存,成为存储级存储器的技术[3-8]。因此,为了在集成电路中实现PCM的直接和及时实施,现在是时候有一个准确的PCM电气模型了。本章介绍了多比特PCM单元的电路模型,该模型准确地模拟了单元的温度分布、晶体分数和电阻作为编程脉冲的函数。此外,还对非晶相的电阻和阈值电压漂移现象进行了精确的建模。将模型的I-V特性与实验数据进行了对比,验证了模型的有效性。接下来,本章将介绍作为存储系统的PCM细胞在纳米交叉棒上的分析。本文还讨论了导线电阻对PCM阵列结构性能的影响、各PCM单元间的能量损失以及PCM单元的编程状态。已经证明,连接电线所消耗的能量减少了提供给PCM电池的功率,从而导致更高的编程低阻状态(Rcrystalline)。此外,还详细讨论了减轻程序结晶可靠性问题的方法。最后,本章讨论了基于pcm的存储器在使用查找表(LUT)实现逻辑功能中的应用,即基于pcm的LUT。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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