{"title":"Applying Sintering and SLID Bonding for Assembly of GaN Chips Working at High Temperatures","authors":"M. Myśliwiec, R. Kisiel","doi":"10.1109/ESTC.2018.8546475","DOIUrl":null,"url":null,"abstract":"In this paper assembly techniques of monocrystalline GaN structures to DBC: sintering and hybrid: sintering + SLID are compared. As an comparison technique shear strength measurements was applied. Study was made on as-received samples, as well as structures aged in temperature above 300 °C for 500 h. Additionally metallographic cross-section of the joints were made and inspected by means of SEM and energy dispersive x-ray spectroscopy. Sintered joints are very porous and does not meet demands for assembly after long term ageing. Hybrid: sintering + SLID joints manufactured at 280 °C are far less porous and fulfil adhesion joint requirements for monocrystalline GaN assembly with excess.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 7th Electronic System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2018.8546475","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
In this paper assembly techniques of monocrystalline GaN structures to DBC: sintering and hybrid: sintering + SLID are compared. As an comparison technique shear strength measurements was applied. Study was made on as-received samples, as well as structures aged in temperature above 300 °C for 500 h. Additionally metallographic cross-section of the joints were made and inspected by means of SEM and energy dispersive x-ray spectroscopy. Sintered joints are very porous and does not meet demands for assembly after long term ageing. Hybrid: sintering + SLID joints manufactured at 280 °C are far less porous and fulfil adhesion joint requirements for monocrystalline GaN assembly with excess.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
