In-situ analysis of electrical conductivity evolution in epoxy-based conductive adhesives with Ag loading during curing process

Abstract

Electrical conductivity evolution of ECAs composed of epoxy-based binders during curing was analyzed using an in-situ viscoelastic characterization (free-damped oscillation method). Variation in electrical conductivity of ECAs was monitored concurrently with the viscoelastic characterization. This work clarified that increase in electrical conductivity of ECAs during curing does not always relate to curing reaction of the binder molecules. Interface chemistry is one of the important factors in determining inter-filler electrical conductance as well as the gap width. Inter-filler chemistry should be taken into account for developing novel ECAs and for optimizing assembly process condition.