Y. Matsuoka, Yong Lee, H. Arimoto, Masataka Sato, S. Komatsuzaki, Akira Ogura, K. Yamazaki, Y. Sunaga, T. Takai, N. Chujo, N. Matsushima
{"title":"A compact 25-Gbit/s × 4ch optical interconnect module with straddle-shaped optical and electrical interface","authors":"Y. Matsuoka, Yong Lee, H. Arimoto, Masataka Sato, S. Komatsuzaki, Akira Ogura, K. Yamazaki, Y. Sunaga, T. Takai, N. Chujo, N. Matsushima","doi":"10.1109/ICSJ.2014.7009626","DOIUrl":null,"url":null,"abstract":"A compact 25-Gbit/s × 4-ch embedded optical module (EOM) composed of a straddle-shaped optical and electrical interface was fabricated and evaluated. The fabricated EOM provides highly efficient optical coupling and large optical-coupling tolerance, and it successfully demonstrated 25-Gbit/s error-free optical transmission. These optical performance results indicate that the fabricated compact EOM can be applied for on-board and rack-to-rack optical interconnections with high transmission density.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE CPMT Symposium Japan 2014","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSJ.2014.7009626","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
A compact 25-Gbit/s × 4-ch embedded optical module (EOM) composed of a straddle-shaped optical and electrical interface was fabricated and evaluated. The fabricated EOM provides highly efficient optical coupling and large optical-coupling tolerance, and it successfully demonstrated 25-Gbit/s error-free optical transmission. These optical performance results indicate that the fabricated compact EOM can be applied for on-board and rack-to-rack optical interconnections with high transmission density.