Theoretical and experimental approach for model extraction of multiconductor interconnects with multiple meshed planes on an APCB

Y. Li, D. Figueroa, S. Zhong, L. Nguyen, T. Nguyen, L. Polka, J. Liao
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引用次数: 4

Abstract

Multiple meshed power and ground planes are quite common in today's advanced PCB's (APCB's). The presence of meshed planes complicates the electrical modeling of interconnects in close proximity to these planes. In order to accurately model multiconductor interconnects near meshed planes, a set of test coupons was characterized. The multiconductor interconnects were modeled as cascaded lossy transmission lines. The interconnect models were validated by performing time- and frequency-domain simulations to match TDR and S-parameter measurements. The validation results from both the time and frequency domains show good agreement between the measured and simulated data. Using the interconnect model developed from the characterization results of the first set of test coupons, crosstalk models were built for multiconductor interconnects with meshed planes. To validate the crosstalk models, a second set of test coupons was analyzed. The crosstalk at both ends of each structure was measured. The measured results were compared with results from simulations. Reasonable agreement was seen between measured and simulated results and the discrepancy is being investigated further.
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APCB多网格多导体互连模型提取的理论与实验方法
在当今先进的PCB (APCB)中,多个网格电源和地平面是相当常见的。网格平面的存在使靠近这些平面的互连的电建模复杂化。为了准确地模拟网格平面附近的多导体互连,对一组测试片进行了表征。多导体互连被建模为级联损耗传输线。通过进行时域和频域仿真来匹配TDR和s参数测量,验证了互连模型。时域和频域的验证结果表明,实测数据与仿真数据吻合较好。利用第一组测试集表征结果建立的互连模型,建立了具有网格平面的多导体互连串扰模型。为了验证串扰模型,对第二组测试票进行了分析。测量了每个结构两端的串扰。将实测结果与仿真结果进行了比较。实测结果与模拟结果基本一致,存在的差异有待进一步研究。
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