Xiangkun Yin, Zhangming Zhu, Yintang Yang, Qijun Lu, Xiaoxian Liu, Yang Liu
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引用次数: 0
Abstract
The three-dimensional integrated circuits (3D ICs) based on through silicon via (TSV) technology offer a solution to meet the continuously increasing demand on high-speed electronic products. In order to comprehensively evaluate the signal transmission of TSV in increasing signal frequency, accuracy equivalent circuit model is necessary. In this paper, a method of double-T type equivalent circuit modelling for TSVs is proposed and applied to coaxial TSV and ground-signal (GS)-type TSVs. Furthermore, the transmission parameters (S21) of the double-T models are evaluated by SPICE and compared with the results of 3-D full-wave electromagnetic field simulation (HFSS). The good accordance of the results up to 50GHz verifies the accuracy of the proposed method.
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