Self-heating and current degradation in 25 nm FD SOI devices with (100) and (110) crystallographic orientation

K. Raleva, D. Vasileska, S. Goodnick
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Abstract

In this paper we present simulation results obtained with our electro-thermal particle-based device simulator for 25 nm fully depleted silicon-on-insulator devices with (100) and (110) crystallographic orientations. We also investigate the importance of the proper choice of the thermal conductivity model (which is particularly important for thin silicon films) in properly predicting the average maximum temperature and the maximum temperature in the hot spot which are important parameters regarding device reliability.
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晶体取向为(100)和(110)的25 nm FD SOI器件的自加热和电流退化
在本文中,我们给出了基于电热粒子的器件模拟器对具有(100)和(110)晶体取向的25 nm完全耗尽绝缘体上硅器件的模拟结果。我们还研究了正确选择热导率模型(这对硅薄膜特别重要)在正确预测平均最高温度和热点最高温度方面的重要性,这是影响器件可靠性的重要参数。
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