Characterization of Moisture Uptake in Microelectronics Packaging Materials

Fabian Huber, H. Etschmaier, A. Wolfberger, A. Singulani, P. Hadley
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引用次数: 1

Abstract

Moisture uptake of materials, used in optoelectronic sensor packaging for the purpose of component attach or for encapsulation, is investigated. The diffusion behavior of these mostly epoxide-based polymer compounds is characterized under various temperature and humidity loads and described using analytical models. The water uptake during soak tests was determined and the data can be fit assuming multistep diffusion behavior. It is assumed that this behavior can be assigned to the formation of hydrogen bonds and moisture absorption in the free volume of the polymer matrix [1]. To investigate this assumption further, in addition to gravimetric methods, the evolution of the O-H stretch modes are measured by Attenuated Total Reflection Fourier Transform Infrared Spectroscopy (ATR-FTIR).
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微电子封装材料吸湿特性研究
研究了光电传感器封装中用于组件附加或封装的材料的吸湿性。这些主要以环氧化物为基础的聚合物化合物在不同温度和湿度载荷下的扩散行为进行了表征,并使用分析模型进行了描述。测定了浸渍试验的吸水率,并在多步扩散条件下拟合数据。假设这种行为可以归因于氢键的形成和聚合物基体自由体积中的吸湿作用[1]。为了进一步验证这一假设,除了采用重量法,还采用衰减全反射傅立叶变换红外光谱(ATR-FTIR)测量了O-H拉伸模式的演变。
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