Influence of yttrium element on the crystallization performance of ZnSb alloy for phase change memory application

Bowen Fu, Weihua Wu, Pei Zhang, Han Gu, Xiaochen Zhou, Xiaoqin Zhu
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Abstract

The crystallization behavior and electrical performance of Y-doped Zn15Sb85 phase change material were proposed and experimental examined. The relationship between the resistance and temperature reveals that the Y dopant is able to enhancing the thermal stability (Tc~237 °C, T10~169 °C) and resistivity (Ra~105 Ω, Rc~102 Ω) of Zn15Sb85 films, which are suitable for automobile design and surface mount technology. XRD results indicate that the Y dopant could effectively inhibit grain growth and reduce grain size. Meanwhile, XPS illustrates that Y is more likely to form bonds with Sb. Further, the resistance drift index and surface roughness become small after doping Y element, which is of great benefit to improving the reliability and electrical performance of the device. Moreover, T-shaped phase change memory cells based on Y0.36(Zn15Sb85)0.64 film were also built and analyzed. The characteristic of current - voltage (I-V) and resistance - voltage (R-V) prove that the SET and RESET operations can be achieved by electric induction, implying the excellent candidate of Y-doped Zn15Sb85 material for high thermal and high reliability application.
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钇元素对相变记忆用ZnSb合金结晶性能的影响
提出了掺y Zn15Sb85相变材料的结晶行为和电学性能,并进行了实验研究。电阻与温度的关系表明,Y掺杂能提高Zn15Sb85薄膜的热稳定性(Tc~237℃,T10~169℃)和电阻率(Ra~105 Ω, Rc~102 Ω),适用于汽车设计和表面贴装技术。XRD结果表明,Y掺杂剂能有效抑制晶粒生长,减小晶粒尺寸。同时,XPS表明,Y更容易与Sb形成键。并且,掺杂Y元素后,器件的电阻漂移指数和表面粗糙度变小,这对提高器件的可靠性和电性能有很大的好处。构建了基于Y0.36(Zn15Sb85)0.64薄膜的t型相变存储单元,并对其进行了分析。电流-电压(I-V)和电阻-电压(R-V)的特性证明了电磁感应可以实现SET和RESET操作,这意味着掺y Zn15Sb85材料是高热和高可靠性应用的优秀候选国。
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