dsReliM: Power-constrained reliability management in Dark-Silicon many-core chips under process variations

M. Salehi, M. Shafique, F. Kriebel, Semeen Rehman, Mohammad Khavari Tavana, A. Ejlali, J. Henkel
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引用次数: 20

Abstract

Due to the tight power envelope, in the future technology nodes it is envisaged that not all cores in a many-core chip can be simultaneously powered-on (at full performance level). The power-gated cores are referred to as Dark Silicon. At the same time, growing reliability issues due to process variations and soft errors challenge the cost-effective deployment of future technology nodes. This paper presents a reliability management system for Dark Silicon chips (dsReliM) that optimizes for reliability of on-chip systems while jointly accounting for soft errors, process variations and the thermal design power (TDP) constraint. Towards the TDP-constrained reliability optimization, dsReliM leverages multiple reliable application versions that can potentially execute on different cores with frequency variations and supporting differenst voltage-frequency levels, thus facilitating distinct power, reliability and performance tradeoffs at run time. Experiments show that our dsReliM system provides up to 20% reliability improvements under different TDP constraints when compared to a state-of-the-art technique. Also, compared to an ideal-case optimal solution, dsReliM deviates up to 2.5% in terms of reliability efficiency, but speeds up the reliability management decision time by a factor of up to 3100.
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dsReliM:工艺变化下暗硅多核芯片的功率约束可靠性管理
由于严格的功率包络,在未来的技术节点中,设想不是多核芯片中的所有核心都可以同时上电(在完全性能水平上)。电源门控核心被称为暗硅。与此同时,由于工艺变化和软错误导致的可靠性问题日益严重,对未来技术节点的经济高效部署提出了挑战。提出了一种暗硅芯片(dsReliM)可靠性管理系统,该系统在考虑软误差、工艺变化和热设计功率(TDP)约束的同时,对片上系统的可靠性进行了优化。为了实现tdp约束下的可靠性优化,dsReliM利用了多个可靠的应用程序版本,这些版本可以在不同频率变化的内核上执行,并支持不同的电压频率水平,从而在运行时促进不同的功耗、可靠性和性能权衡。实验表明,与最先进的技术相比,我们的dsReliM系统在不同的TDP约束下提供了高达20%的可靠性提高。此外,与理想情况下的最优解决方案相比,dsReliM在可靠性效率方面的偏差高达2.5%,但将可靠性管理决策时间提高了3100倍。
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