High power LED heat dissipation analysis using cylindrical Al based slug using Ansys

Abstract

Thermal management is a prime concern in the LED lighting industry as the reliability and performance of the LED is significantly affected by the heat produced within the LED package. The evaluation of junction temperature is one of the methods used to determine the heat dissipation of a LED. This paper demonstrates the heat dissipation of a single chip high power LED package through simulation. The junction temperature and the stress of the LED chip with cylindrical aluminum heat slug were assessed. Simulation was carried at natural convection condition using Ansys version 11. The evaluation was done at input power of 0.1 W and 1 W. Result showed that at input power of 1 W, the maximum junction temperature of the LED chip is 121.71°C with Von Mises stress of 277.70 MPa.