Omitting Refresh: A Case Study for Commodity and Wide I/O DRAMs

Matthias Jung, Éder F. Zulian, Deepak M. Mathew, M. Herrmann, Christian Brugger, C. Weis, N. Wehn
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引用次数: 41

Abstract

Dynamic Random Access Memories (DRAM) have a big impact on performance and contribute significantly to the total power consumption in systems ranging from mobile devices to servers. Up to half of the power consumption of future high density DRAM devices will be caused by refresh commands. Moreover, not only the refresh rate does depend on the device capacity, but it strongly depends on the temperature as well. In case of 3D integration of MPSoCs with Wide I/O DRAMs the power density and thermal dissipation are increased dramatically. Hence, in 3D-DRAM even more DRAM refresh operations are required. To master these challenges, clever DRAM refresh strategies are mandatory either on hardware or on software level using new or already available infrastructures and implementations, such as Partial Array Self Refresh (PASR) or Temperature Compensated Self Refresh (TCSR). In this paper, we show that for dedicated applications refresh can be disabled completely without or with negligible impact on the application performance. This is possible if it is assured that either the lifetime of the data is shorter than the currently required DRAM refresh period or if the application can tolerate bit errors to some degree in a given time window.
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省略刷新:商品和宽I/O dram的案例研究
动态随机存取存储器(DRAM)对性能有很大影响,并且对从移动设备到服务器的系统的总功耗有很大贡献。在未来的高密度DRAM设备中,高达一半的功耗将由刷新命令引起。此外,刷新率不仅与设备容量有关,还与温度密切相关。当mpsoc与Wide I/O dram 3D集成时,功率密度和散热显著提高。因此,在3D-DRAM中甚至需要更多的DRAM刷新操作。为了应对这些挑战,聪明的DRAM刷新策略必须在硬件或软件层面上使用新的或已经可用的基础设施和实现,例如部分阵列自我刷新(PASR)或温度补偿自我刷新(TCSR)。在本文中,我们展示了对于专用应用程序,可以完全禁用刷新,而不会或对应用程序性能的影响可以忽略不计。如果可以确保数据的生命周期短于当前所需的DRAM刷新周期,或者应用程序可以在给定的时间窗口内容忍一定程度的位错误,那么这是可能的。
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