{"title":"Effect of bonding parameters on thermosonic flip chip bonding under pressure constraint pattern","authors":"Fuliang Wang, Junhui Li, Lei Han, J. Zhong","doi":"10.1109/HDP.2006.1707571","DOIUrl":null,"url":null,"abstract":"Thermosonic flip chip (TSFC) was performed and studied under the pressure constraint pattern, in which the flip chip is restricted by bonding force. Effects of bonding parameters on bonding strength were studied. Results show that bonding force and ultrasonic power have primary effects on bonding strength. The bonding strength is related to ultrasonic energy used in bonding interface, moderate energy is necessary for high bonding strength, and overabundance or inadequate of energy will cause low bonding strength","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HDP.2006.1707571","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Thermosonic flip chip (TSFC) was performed and studied under the pressure constraint pattern, in which the flip chip is restricted by bonding force. Effects of bonding parameters on bonding strength were studied. Results show that bonding force and ultrasonic power have primary effects on bonding strength. The bonding strength is related to ultrasonic energy used in bonding interface, moderate energy is necessary for high bonding strength, and overabundance or inadequate of energy will cause low bonding strength
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