A compact multi-channel receiver front-end using SiP integration technology on LTCC substrate for wireless communications

Abstract

This paper presents a compact multi-channel receiver front-end using system-in-package (SiP) integration technology. In the circuit linking design, a power divider network is introduced to keep the amplitude consistency of the local oscillator (LO) signal for each channel. The embedded low temperature co-fired ceramic (LTCC) RF filter equipped with two transmission zeros is developed by using substrate integrated waveguide (SIW) technology and its design and tuning techniques are discussed. Based on a viable LTCC SiP structure and micro-packaging technology, the receiver front-end module is fabricated and all the functional devices are integrated on a single substrate. The measured results indicate that the module has high selectivity as well as the great conversion gain and low noise figure of 50 dB and 2.8 dB respectively. The overall size of the three-channel module is about 36 mm ×23 mm × 3 mm.