New Insight for next Generation SRAM: Tunnel FET versus FinFET for Different Topologies

Adriana Arevalo, Romain Liautard, Daniel Romero, L. Trojman, L. Prócel
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引用次数: 4

Abstract

The purpose of this work is to point out the main differences between a Static Random-Access Memory (SRAM) cells implemented by using Tunnel FET (TFET) and FinFET technologies. We have compared the behavior of SRAM cells implemented in both technologies cells for a supply voltage range from 0.4V to 1.2V. Furthermore, for our study, we have chosen different SRAM cell topologies, such as 6T, 8T, 9T and 10T. Therefore, we have simulated all of these topologies for both technologies and extracted the Static Noise Margins (SNM) for the reading and writing processes. In addition, we have determined the power consumption in order to find the best trade-off between stability and power. By analyzing these results, we have determined the best topology for each technology. Finally, we have compared these best topologies for each technology in order to perform a study of advantages and shortcomings. Our results show more advantages using TFET technology instead of FinFET one.
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新一代SRAM:隧道场效应管与不同拓扑结构的FinFET
本研究的目的是指出使用隧道场效应管(TFET)和FinFET技术实现的静态随机存取存储器(SRAM)单元之间的主要区别。我们比较了两种技术中SRAM电池在供电电压范围为0.4V至1.2V时的性能。此外,在我们的研究中,我们选择了不同的SRAM单元拓扑,如6T, 8T, 9T和10T。因此,我们模拟了这两种技术的所有这些拓扑结构,并提取了读取和写入过程的静态噪声边界(SNM)。此外,我们还确定了功耗,以便在稳定性和功率之间找到最佳权衡。通过分析这些结果,我们确定了每种技术的最佳拓扑。最后,我们比较了每种技术的最佳拓扑结构,以便研究其优缺点。我们的研究结果表明,使用TFET技术比使用FinFET技术更有优势。
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