{"title":"Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices","authors":"N. Kinjo, M. Ogata, K. Nishi, A. Kaneda, K. Dušek","doi":"10.1007/BFB0017963","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":102004,"journal":{"name":"Speciality Polymers / Polymer Physics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"164","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Speciality Polymers / Polymer Physics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/BFB0017963","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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