LAP: a logic activity packing methodology for leakage power-tolerant FPGAs

Hassan Hassan, M. Anis, M. Elmasry
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引用次数: 7

Abstract

As FPGAs enter the nanometer regime, several modifications are needed to reduce the increasing leakage power dissipation. Hence, this work presents some modifications to the FPGAs CAD flow to mitigate leakage power dissipation through the use of multi-threshold CMOS technologies to pack and place logic blocks that exhibit similar idleness close to each other so they can be turned off during their idle time. The modifications are integrated into the VPR flow and tested on several FPGA benchmarks using a CMOS 0.13/spl mu/m dual-V/sub th/ technology, resulting in an average leakage power savings of at least 20%.
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LAP:一种用于容漏功率fpga的逻辑活动封装方法
随着fpga进入纳米时代,需要对其进行一些改进以降低不断增加的泄漏功耗。因此,这项工作提出了对fpga CAD流程的一些修改,通过使用多阈值CMOS技术来封装和放置具有相似空闲的逻辑块,从而减少泄漏功耗,从而可以在空闲时间关闭它们。这些改进被集成到VPR流程中,并使用CMOS 0.13/spl mu/m双v /sub /技术在多个FPGA基准测试中进行了测试,平均泄漏功耗节省至少20%。
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