Millimeter-wave silicon transistor and benchmark circuit scaling through the 2030 ITRS horizon

S. Voinigescu, S. Shopov, P. Chevalier
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引用次数: 6

Abstract

This paper reviews the technology requirements of future mm-wave systems-on-chip and the challenges facing mm-wave MOSFET and SiGe HBT device and benchmark circuit scaling towards 3nm gate length and beyond 1.5THz fMAX. Measurements of state-of-the-art MOSFETs, HBTs and cascodes are presented from DC to 325 GHz. Finally, simulations of the scaling of the SiGe HBT mm-wave benchmark circuit performance across future technology nodes predict that PAs with 45% PAE at 220 GHz, and transimpedance amplifiers with over 175GHz bandwidth and less than 3dB noise figure will become feasible by the year 2030.
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毫米波硅晶体管和基准电路缩放到2030年ITRS地平线
本文综述了未来毫米波片上系统的技术要求,以及毫米波MOSFET和SiGe HBT器件以及基准电路向3nm栅极长度和1.5THz fMAX扩展所面临的挑战。最先进的mosfet, hbt和级联码的测量从直流到325 GHz。最后,对未来技术节点上SiGe HBT毫米波基准电路性能的缩放模拟预测,到2030年,220 GHz时PAE为45%的PAs和带宽超过175GHz、噪声系数小于3dB的跨阻放大器将成为可能。
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