Development of an instrumented glass microchannel device for critical heat flux visualization and studies [IC cooling applications]

A. Jain, T. Borca-Tasciuc, A. P. Roday, M. Jensen, S. Kandlikar
{"title":"Development of an instrumented glass microchannel device for critical heat flux visualization and studies [IC cooling applications]","authors":"A. Jain, T. Borca-Tasciuc, A. P. Roday, M. Jensen, S. Kandlikar","doi":"10.1109/STHERM.2005.1412155","DOIUrl":null,"url":null,"abstract":"Boiling in microchannels is an important candidate for cooling of electronic chips. A crucially important factor in the design of microchannel boiling heat transfer is the critical heat flux (CHF). This work presents the development of a glass microchannel device for quantitative investigations of CHF and visualization of boiling phenomena at microscale. The device is instrumented with heaters and temperature sensors to map the temperature distribution in the axial direction. The use of low thermal conductivity glass reduces the heat conduction losses, and improves the accuracy of CHF values extracted from experimental results. This work presents the fabrication and packaging of a single microchannel device.","PeriodicalId":256936,"journal":{"name":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","volume":"63 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2005.1412155","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

Boiling in microchannels is an important candidate for cooling of electronic chips. A crucially important factor in the design of microchannel boiling heat transfer is the critical heat flux (CHF). This work presents the development of a glass microchannel device for quantitative investigations of CHF and visualization of boiling phenomena at microscale. The device is instrumented with heaters and temperature sensors to map the temperature distribution in the axial direction. The use of low thermal conductivity glass reduces the heat conduction losses, and improves the accuracy of CHF values extracted from experimental results. This work presents the fabrication and packaging of a single microchannel device.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
用于临界热流可视化和研究的仪表化玻璃微通道装置的开发[IC冷却应用]
微通道沸腾是电子芯片冷却的重要选择。临界热流密度是微通道沸腾传热设计中一个至关重要的因素。这项工作提出了一个玻璃微通道装置的发展,用于定量研究CHF和在微观尺度上沸腾现象的可视化。该装置装有加热器和温度传感器,以绘制轴向温度分布。低导热玻璃的使用减少了热传导损失,提高了从实验结果中提取的CHF值的准确性。本工作介绍了单个微通道器件的制造和封装。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Rudimentary finite element thermal modeling of platelet-filled polymer-ceramic composites Smart chip, system and data center enabled by advanced flexible cooling resources Temperature mapping of metal interconnects using scanning thermoreflectance microscope A practical implementation of silicon microchannel coolers for high power chips Potential thermal security risks
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1