J. J. Rodriguez, J. Reichl, Z. Parrilla, Allen R. Hefner, D. Berning, Miguel Velez-Reyes, Jih-Sheng Lai
{"title":"Thermal component models for electro thermal analysis of multichip power modules","authors":"J. J. Rodriguez, J. Reichl, Z. Parrilla, Allen R. Hefner, D. Berning, Miguel Velez-Reyes, Jih-Sheng Lai","doi":"10.1109/IAS.2002.1044094","DOIUrl":null,"url":null,"abstract":"Thermal component models are developed for multi-chip of insulated gate bipolar transistor (IGBT) power electronic modules (PEM) and associated high-power converter heat sinks. The models are implemented in SABER and are combined with the electro-thermal IGBT and diode models to simulate the electro-thermal performance of high power converter systems. The thermal component models are parameterized in terms of structural and material parameters so that they can be readily used to develop a library of component models for the various commercially available power modules. The paper presents model development and implementation in SABER, simulation results, and validation using experimental data.","PeriodicalId":202482,"journal":{"name":"Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-12-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"29","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IAS.2002.1044094","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 29
Abstract
Thermal component models are developed for multi-chip of insulated gate bipolar transistor (IGBT) power electronic modules (PEM) and associated high-power converter heat sinks. The models are implemented in SABER and are combined with the electro-thermal IGBT and diode models to simulate the electro-thermal performance of high power converter systems. The thermal component models are parameterized in terms of structural and material parameters so that they can be readily used to develop a library of component models for the various commercially available power modules. The paper presents model development and implementation in SABER, simulation results, and validation using experimental data.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
