Wireless device performance management in temperature limited scenarios

Abstract

Increasing demand on wireless communication capabilities and device integration elevates thermal effects to a key boundary condition for future SoC designs. Questions arise like how long can the device be operated on certain radio conditions and for which ambient temperature regions, in a sustainable fashion. How fast will heat issues be perceived as inconvenient by the device user, how fast must device reliability be considered on high temperature and at which level needs a thermal runaway be prevented from kickoff by methods like autonomous shutdown? Wireless device performance management needs to deal with thermal challenges, understand radio communication hurdles and come up with an appropriate power throttling strategy.