Wei Zhang, G. Du, Qiang Li, Aiqing Zhang, Z. Mo, Xiaoyan Liu, Pingwen Zhang
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引用次数: 8
Abstract
We developed a 3D parallel full band Monte Carlo simulator for semiconductor devices. This enables us to simulate 3D devices on high performance multiprocessor machines. By utilizing the JASMIN [1] software package, parallel execution issues such as processors communication, grid partitioning and load balancing are handled easily and efficiently. The 3D MC simulator is validated by comparing its results with that from 2D 70nm SOI MOSFET simulations. We present speedup and load balancing results of our 3D simulator to show the parallel efficiency. A FinFet model [2], [3] is simulated for application.
我们开发了一个用于半导体器件的三维并行全带蒙特卡罗模拟器。这使我们能够在高性能多处理器机器上模拟3D设备。通过使用JASMIN[1]软件包，可以轻松高效地处理处理器通信、网格分区和负载平衡等并行执行问题。通过与2D 70nm SOI MOSFET模拟结果的比较，验证了3D MC模拟器的有效性。我们给出了3D模拟器的加速和负载平衡结果，以显示并行效率。为了应用，对FinFet模型[2]，[3]进行了仿真。
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