Crack Detection for Non-Metallic Material Using Split Ring Resonator-based Chipless RFID Sensor

Sirisak Nongpromma, Suwan Janin, K. Kaemarungsi, A. Boonpoonga, D. Torrungrueng, Lakkhana Bannawat
{"title":"Crack Detection for Non-Metallic Material Using Split Ring Resonator-based Chipless RFID Sensor","authors":"Sirisak Nongpromma, Suwan Janin, K. Kaemarungsi, A. Boonpoonga, D. Torrungrueng, Lakkhana Bannawat","doi":"10.1109/ECTI-CON58255.2023.10153249","DOIUrl":null,"url":null,"abstract":"The study presented a novel chipless RFID sensor designed for the detection of cracks in non-metallic materials. The sensor utilized square coplanar split-ring resonators (SRR) and was mounted on the material under test (MUT), including materials such as Teflon (PTFE), Polycarbonate, and Kapton (Polyimide), for detecting cracks. To assess the effectiveness of the sensor in detecting cracks, simulation experiments were conducted using the CST Microwave Studio software, which analyzed shifts in the resonant frequency. The resulting RCS spectra demonstrated a clear correlation between the size of the crack and the resonance frequencies of the chipless RFID sensor, confirming the sensor’s ability to detect cracks in nonmetallic materials.","PeriodicalId":340768,"journal":{"name":"2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTI-CON58255.2023.10153249","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The study presented a novel chipless RFID sensor designed for the detection of cracks in non-metallic materials. The sensor utilized square coplanar split-ring resonators (SRR) and was mounted on the material under test (MUT), including materials such as Teflon (PTFE), Polycarbonate, and Kapton (Polyimide), for detecting cracks. To assess the effectiveness of the sensor in detecting cracks, simulation experiments were conducted using the CST Microwave Studio software, which analyzed shifts in the resonant frequency. The resulting RCS spectra demonstrated a clear correlation between the size of the crack and the resonance frequencies of the chipless RFID sensor, confirming the sensor’s ability to detect cracks in nonmetallic materials.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于裂环谐振器的无芯片RFID传感器在非金属材料裂纹检测中的应用
提出了一种用于非金属材料裂纹检测的新型无芯片RFID传感器。该传感器采用方形共面劈环谐振器(SRR),安装在被测材料(MUT)上,包括聚四氟乙烯(PTFE)、聚碳酸酯和卡普顿(聚酰亚胺)等材料,用于检测裂纹。为了评估传感器检测裂纹的有效性,使用CST Microwave Studio软件进行了模拟实验,分析了谐振频率的变化。由此产生的RCS光谱表明,裂纹的大小与无芯片RFID传感器的共振频率之间存在明显的相关性,证实了传感器检测非金属材料裂纹的能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Developing and Implementing a Real-Time Mass Health Screening System: MFU.Pass Low-Frequency Wave Propagation in the Cave Developing Steps for Learning Programming through Gamification Hyperbolic Pattern Detection in Ground Penetrating Radar Images Using Faster R-CNN CMA-Based Metasurface-Based Circularly Polarized Patch Antenna for SATCOM Applications
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1