{"title":"Microwave/millimeter devices for multilayer 3D-System-On-Packaging (SOP) technology using Liquid Crystal Polymer (LCP) material","authors":"E. O. Boadu, M. T. Elsir, M. Hossin, A. Amoah","doi":"10.1109/MMWCST.2012.6238152","DOIUrl":null,"url":null,"abstract":"We describe a new class of microwave/millimeter device utilizing Liquid Crystal Polymer (LCP) material which has showed a combination of good electrical and mechanical properties. This paper presents the design and simulation of a fully System-On-Package (SOP) antenna module that will be suitable for 5GHz WLAN application with high performance. The proposed antenna is printed on a flexible LCP layer, protruding from a rigid multilayer organic substrate. The shielding effect of the metal case which protects the module circuitry from the near fields of the antenna was also taken care of during the design.","PeriodicalId":150727,"journal":{"name":"The 2012 International Workshop on Microwave and Millimeter Wave Circuits and System Technology","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 2012 International Workshop on Microwave and Millimeter Wave Circuits and System Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MMWCST.2012.6238152","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
We describe a new class of microwave/millimeter device utilizing Liquid Crystal Polymer (LCP) material which has showed a combination of good electrical and mechanical properties. This paper presents the design and simulation of a fully System-On-Package (SOP) antenna module that will be suitable for 5GHz WLAN application with high performance. The proposed antenna is printed on a flexible LCP layer, protruding from a rigid multilayer organic substrate. The shielding effect of the metal case which protects the module circuitry from the near fields of the antenna was also taken care of during the design.
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