Risk analysis of reflow technologies in electronics assembly

Abstract

This article deals with risk analysis of different reflow technologies in electronics assembly. Risk analysis is concerned to reduce the probability of occurrence of particular risks or decrease its influence on project or production. There are plenty of advantages which can be realized from rigorously performed risk management. Reflow process is one part of the surface mount technology (SMT - technology where components are mounted directly onto the surface of printed circuit board). Reflow process in SMT is necessary to heat the solder paste. During the heating process the solder paste become melt and starts wetting components together with contact pads of printed circuit board. The goal of this article is to present and remind some significant hazards of three basic reflow technologies - vapor phase soldering, hot air soldering and infrared technology. After all we try to highlight risks and we present concrete problems for each reflow technology.