SCARE: Side-Channel Analysis Based Reverse Engineering for Post-Silicon Validation

Abstract

Reverse Engineering (RE) has been historically considered as a powerful approach to understand electronic hardware in order to gain competitive intelligence or accomplish piracy. In recent years, it has also been looked at as a way to authenticate hardware intellectual properties in the court of law. In this paper, we propose a beneficial role of RE in post-silicon validation of integrated circuits (IC) with respect to IC functionality, reliability and integrity. Unlike traditional destructive RE approaches, we propose a fast non-destructive side-channel analysis approach that can hierarchically extract structural information from an IC through its transient current signature. Such a top-down side-channel analysis approach is capable of reliably identifying pipeline stages and functional blocks. It is also suitable to distinguish sequential elements from combinational gates. For extraction of random logic structures (e.g. control blocks and finite state machines) we combine side-channel analysis with logic testing based Boolean function extraction. The proposed approach is amenable to automation, scalable, and can be applied as part of post-silicon validation process to verify that each IC implements exclusively the functionality described in the specification and is free from malicious modification or Trojan attacks. Simulation results on a pipelined DLX processor demonstrate the effectiveness of the proposed approach.