{"title":"Thermal properties of graphene and few-layer graphene: applications in electronics","authors":"Zhong Yan, D. Nika, A. Balandin","doi":"10.1049/iet-cds.2014.0093","DOIUrl":null,"url":null,"abstract":"The authors review thermal properties of graphene and few-layer graphene (FLG), and discuss applications of these materials in thermal management of advanced electronics. The intrinsic thermal conductivity of graphene - among the highest of known materials - is dominated by phonons near the room temperature. The examples of thermal management applications include the FLG heat spreaders integrated near the heat generating areas of the high-power density transistors. It has been demonstrated that FLG heat spreaders can lower the hot-spot temperature during device operation, resulting in improved performance and reliability of the devices.","PeriodicalId":120076,"journal":{"name":"IET Circuits Devices Syst.","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2015-01-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"90","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Circuits Devices Syst.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1049/iet-cds.2014.0093","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 90
Abstract
The authors review thermal properties of graphene and few-layer graphene (FLG), and discuss applications of these materials in thermal management of advanced electronics. The intrinsic thermal conductivity of graphene - among the highest of known materials - is dominated by phonons near the room temperature. The examples of thermal management applications include the FLG heat spreaders integrated near the heat generating areas of the high-power density transistors. It has been demonstrated that FLG heat spreaders can lower the hot-spot temperature during device operation, resulting in improved performance and reliability of the devices.