{"title":"High-voltage HBT technology","authors":"D. Hill","doi":"10.1109/GAAS.1998.722652","DOIUrl":null,"url":null,"abstract":"This paper describes the status of HBT technology for applications at 12 V and above. Design and process considerations for fabrication of HBTs with high breakdown voltage are discussed, along with a general approach for reduced thermal resistance. Current understanding of high-voltage HBT reliability and market outlook are reviewed.","PeriodicalId":288170,"journal":{"name":"GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 20th Annual. Technical Digest 1998 (Cat. No.98CH36260)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 20th Annual. Technical Digest 1998 (Cat. No.98CH36260)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAAS.1998.722652","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
This paper describes the status of HBT technology for applications at 12 V and above. Design and process considerations for fabrication of HBTs with high breakdown voltage are discussed, along with a general approach for reduced thermal resistance. Current understanding of high-voltage HBT reliability and market outlook are reviewed.
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