Pingfeng Wu, Runji Fang, X. Dai, Anak Agung Ayu Putri
{"title":"Analysis and Optimization of Heat Dissipation Characteristics of High-power LED","authors":"Pingfeng Wu, Runji Fang, X. Dai, Anak Agung Ayu Putri","doi":"10.1145/3480571.3480630","DOIUrl":null,"url":null,"abstract":"∗In this paper, to solve the practical problem in heat dissipation technology of high-power Light Emitting Diode (LED) radiators, the heat dissipation characteristics were analyzed in terms of the heat transfer theory, LED operating principle, composition and structure. Firstly, the high-power LED down light was modeled in Creo, and the model was simplified after the simulation conditions for thermal analysis were set. Thermal analysis and thermal stress analysis were carried out in ANSYS to obtain the temperature and thermal stress distribution status. Secondly, contrast tests were conducted by changing a single variable (such as the fin thickness & quantity and base plate thickness of radiators) and keeping other conditions unchanged, so as to find out the respective effect law of the variables on the heat dissipation of high-power LED down lights and the key factors affecting heat dissipation. Finally, orthogonal tests were carried out, that is, an orthogonal table with three factors (the fin thickness, quantity and base plate thickness of radiators) and four levels was built for in-depth analysis, and the data in the table were subject to efficiency analysis and range analysis to obtain the optimized results. The optimization scheme proposed in this paper has improved the heat dissipation capability and operating efficiency of LED down lights, providing direction and guidance for future research on heat dissipation.","PeriodicalId":113723,"journal":{"name":"Proceedings of the 6th International Conference on Intelligent Information Processing","volume":"19 4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 6th International Conference on Intelligent Information Processing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3480571.3480630","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
∗In this paper, to solve the practical problem in heat dissipation technology of high-power Light Emitting Diode (LED) radiators, the heat dissipation characteristics were analyzed in terms of the heat transfer theory, LED operating principle, composition and structure. Firstly, the high-power LED down light was modeled in Creo, and the model was simplified after the simulation conditions for thermal analysis were set. Thermal analysis and thermal stress analysis were carried out in ANSYS to obtain the temperature and thermal stress distribution status. Secondly, contrast tests were conducted by changing a single variable (such as the fin thickness & quantity and base plate thickness of radiators) and keeping other conditions unchanged, so as to find out the respective effect law of the variables on the heat dissipation of high-power LED down lights and the key factors affecting heat dissipation. Finally, orthogonal tests were carried out, that is, an orthogonal table with three factors (the fin thickness, quantity and base plate thickness of radiators) and four levels was built for in-depth analysis, and the data in the table were subject to efficiency analysis and range analysis to obtain the optimized results. The optimization scheme proposed in this paper has improved the heat dissipation capability and operating efficiency of LED down lights, providing direction and guidance for future research on heat dissipation.