Antenna integration with laser diodes and photodetectors for a miniaturized dual-mode wireless transceiver

J. Liao, Shengling Deng, K. Connor, V. Joyner, Z.R. Huang
{"title":"Antenna integration with laser diodes and photodetectors for a miniaturized dual-mode wireless transceiver","authors":"J. Liao, Shengling Deng, K. Connor, V. Joyner, Z.R. Huang","doi":"10.1109/ECTC.2008.4550235","DOIUrl":null,"url":null,"abstract":"In this paper, a dual split director quasi-yagi antenna is introduced for RF/FSO integration. Bare die laser diodes and photodetectors are assembled on the antenna directors on the duroid substrate. Coupling between RF and optical dual mode wireless communication system is analyzed.","PeriodicalId":378788,"journal":{"name":"2008 58th Electronic Components and Technology Conference","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 58th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2008.4550235","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

In this paper, a dual split director quasi-yagi antenna is introduced for RF/FSO integration. Bare die laser diodes and photodetectors are assembled on the antenna directors on the duroid substrate. Coupling between RF and optical dual mode wireless communication system is analyzed.
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天线集成激光二极管和光电探测器的小型化双模无线收发器
本文介绍了一种用于射频/FSO集成的双分裂定向准八木天线。裸模激光二极管和光电探测器组装在二极管衬底上的天线导向上。分析了射频与光双模无线通信系统之间的耦合关系。
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