{"title":"Display driver interconnect technology for military and avionic AMLCD","authors":"R. Reynolds","doi":"10.1109/DASC.1996.559166","DOIUrl":null,"url":null,"abstract":"The two most important display driver interconnect technology candidates for military and avionic AMLCD are tape automated bonding (TAB), and flip chip on glass (FCOG). These two technologies will be reviewed and compared in detail. The topics presented include: maturity of the respective technologies; infrastructure differences; known good die issues; FCOG layout issues; processing and run rate issues; reliability considerations; and FCOG rework issues.","PeriodicalId":332554,"journal":{"name":"15th DASC. AIAA/IEEE Digital Avionics Systems Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1996-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"15th DASC. AIAA/IEEE Digital Avionics Systems Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DASC.1996.559166","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The two most important display driver interconnect technology candidates for military and avionic AMLCD are tape automated bonding (TAB), and flip chip on glass (FCOG). These two technologies will be reviewed and compared in detail. The topics presented include: maturity of the respective technologies; infrastructure differences; known good die issues; FCOG layout issues; processing and run rate issues; reliability considerations; and FCOG rework issues.
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