Analysis of compounds in airborne dust collected in Beijing

Electrical Contacts - 1998. Proceedings of the Forty-Fourth IEEE Holm Conference on Electrical Contacts (Cat. No.98CB36238) Pub Date : 1998-10-26 DOI:10.1109/HOLM.1998.722442

Ji-gao Zhang, Yaqi Liang, J. Wan, Bai-Sheng Sun

{"title":"Analysis of compounds in airborne dust collected in Beijing","authors":"Ji-gao Zhang, Yaqi Liang, J. Wan, Bai-Sheng Sun","doi":"10.1109/HOLM.1998.722442","DOIUrl":null,"url":null,"abstract":"A comprehensive analysis of the organic compounds of the airborne dust collected in Beijing University of Post and Telecommunications has been carried out by combined application of four analytic methods including infrared spectroscopy, gas chromatography-mass spectrometry (GC/MS), high performance liquid chromatography-mass spectrometry (LC/MS) and thermogravimetric analysis. The aim is to gain a better understanding of the main organic constituents in the dust and seek an efficient method for analysis of the organic compounds. The results show that weight percentage of the organic compounds and \"black\" carbon is about 20% of the dust. The main constituents of the organic compounds are a series of alkanes (C/sub 7/-C/sub 40+/) and two ortho-benzendicarboxylic acid esters. These materials probably are from the chimney of the central heating station and exhaust gas of vehicles. Evidences show that the organics in dust may also contribute to electrical contact failures of connectors and cannot be ignored.","PeriodicalId":371014,"journal":{"name":"Electrical Contacts - 1998. Proceedings of the Forty-Fourth IEEE Holm Conference on Electrical Contacts (Cat. No.98CB36238)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Contacts - 1998. Proceedings of the Forty-Fourth IEEE Holm Conference on Electrical Contacts (Cat. No.98CB36238)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOLM.1998.722442","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 12

Abstract

A comprehensive analysis of the organic compounds of the airborne dust collected in Beijing University of Post and Telecommunications has been carried out by combined application of four analytic methods including infrared spectroscopy, gas chromatography-mass spectrometry (GC/MS), high performance liquid chromatography-mass spectrometry (LC/MS) and thermogravimetric analysis. The aim is to gain a better understanding of the main organic constituents in the dust and seek an efficient method for analysis of the organic compounds. The results show that weight percentage of the organic compounds and "black" carbon is about 20% of the dust. The main constituents of the organic compounds are a series of alkanes (C/sub 7/-C/sub 40+/) and two ortho-benzendicarboxylic acid esters. These materials probably are from the chimney of the central heating station and exhaust gas of vehicles. Evidences show that the organics in dust may also contribute to electrical contact failures of connectors and cannot be ignored.

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北京地区空气中粉尘成分分析

采用红外光谱、气相色谱-质谱(GC/MS)、高效液相色谱-质谱(LC/MS)和热重分析四种分析方法，对北京邮电大学收集的空气粉尘中的有机化合物进行了综合分析。其目的是更好地了解灰尘中的主要有机成分，并寻求一种有效的有机化合物分析方法。结果表明，有机化合物和“黑”碳的重量百分比约为粉尘的20%。有机化合物的主要成分是一系列烷烃(C/亚7/ C/亚40+/)和两个邻苯二甲酸酯。这些物质可能来自中央供暖站的烟囱和车辆的废气。有证据表明，粉尘中的有机物也可能导致连接器的电接触失效，不容忽视。

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Electrical Contacts - 1998. Proceedings of the Forty-Fourth IEEE Holm Conference on Electrical Contacts (Cat. No.98CB36238)

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