Evaluating the impact of spike and flicker noise in phase change memories

Salin Junsangsri, F. Lombardi, Jie Han
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Abstract

This paper presents a simulation-based analysis of spike and flicker noise in a Phase Change Memory (PCM); this investigation is based on HSPICE simulation by taking into account cell-level (with its neighbors) and array-level considerations. State switching phenomena in binary PCM memories are dealt in detail to assess the impact of these two types of noise. It is shown that a lower feature size is of concern for flicker noise in terms of value and percentage variation (while not substantially affecting array-level performance). This paper also shows that spike noise has a radically different behavior: spike noise shows a dependency on the PCM resistance more than the type of state of the PCM. It increases substantially when the amorphous resistance increases and has a nearly constant value when the memory cell is changing to an amorphous state.
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评估脉冲和闪烁噪声对相变存储器的影响
本文提出了一种基于仿真的相变存储器(PCM)中尖峰和闪烁噪声的分析方法;这项研究是基于HSPICE模拟,考虑到单元级(与其邻居)和数组级的考虑。详细讨论了二进制PCM存储器中的状态切换现象,以评估这两种噪声的影响。结果表明,较低的特征尺寸会影响闪烁噪声的值和百分比变化(而不会对阵列级性能产生实质性影响)。本文还表明,尖峰噪声具有完全不同的行为:尖峰噪声对PCM电阻的依赖性大于对PCM状态类型的依赖性。当非晶态电阻增加时,它显著增加,当存储单元转变为非晶态时,它具有几乎恒定的值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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