{"title":"Flip-chip bonding: How to meet high accuracy requirements?","authors":"Caroline Avrillier, P. Metzger","doi":"10.23919/EMPC.2017.8346863","DOIUrl":null,"url":null,"abstract":"This paper presents considerations on key parameters to obtain a high accuracy flip-chip bonding. Mutual interaction between three main blocks, the flip-chip bonder, the components to be bonded and the environment where the process is done is crucial. Three applications will illustrate these considerations.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EMPC.2017.8346863","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
This paper presents considerations on key parameters to obtain a high accuracy flip-chip bonding. Mutual interaction between three main blocks, the flip-chip bonder, the components to be bonded and the environment where the process is done is crucial. Three applications will illustrate these considerations.
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