{"title":"Potential packaging solutions for integrated single-chip transceivers above 100 GHz","authors":"S. Beer, T. Zwick","doi":"10.1109/APCAP.2012.6333219","DOIUrl":null,"url":null,"abstract":"This paper discusses different packaging options for integrated single-chip transceivers above 100 GHz. Multi-layer technologies, thin-film antennas and Embedded Wafer BGA packaging are shortly introduced. Using the example of a highly advanced 120-GHz monostatic Radar IC, it is then discussed which technology offers the best option to reliably package the IC.","PeriodicalId":178493,"journal":{"name":"2012 IEEE Asia-Pacific Conference on Antennas and Propagation","volume":"196 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Asia-Pacific Conference on Antennas and Propagation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APCAP.2012.6333219","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper discusses different packaging options for integrated single-chip transceivers above 100 GHz. Multi-layer technologies, thin-film antennas and Embedded Wafer BGA packaging are shortly introduced. Using the example of a highly advanced 120-GHz monostatic Radar IC, it is then discussed which technology offers the best option to reliably package the IC.
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