On the oxide thickness dependence of the time-dependent-dielectric-breakdown

S. Oussalah, F. Nebel
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引用次数: 14

Abstract

In this work, we investigate the reliability of SiO/sub 2/ films ranging from 20 to 65 nm. Time-dependent dielectric breakdown (TDDB) tests are conducted under constant current injection. Assuming that the logarithm of the median-time-to-failure, In(t/sub 50/), is described by a linear electric field dependence. A generalized law for the long-term reliability of the dielectric, taking into account the applied electric field and the dielectric thickness, is proposed.
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随时间介质击穿对氧化物厚度的依赖性
在这项工作中,我们研究了SiO/ sub2 /薄膜在20至65 nm范围内的可靠性。在恒流注入条件下进行了随时间变化的介质击穿(TDDB)试验。假设中位失效时间的对数In(t/sub 50/)由线性电场依赖关系描述。在考虑外加电场和介质厚度的情况下,提出了电介质长期可靠性的广义规律。
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