Glancing Angle FIB De-layering for Embedded Defect and PVC Fault Isolation Analysis

Abstract

In this work we reported a work flow of de-layering method by using glancing angle FIB milling for IC failure analysis. This method doesn't require cleaving the sample cross-section which increases risk of damaging target structure. Instead, a combination of precise laser ablation and FIB milling is used to create a large viewing window before glancing angle FIB milling. Our results demonstrated that the method can become useful alternative of conventional mechanical and/or chemical polishing and were successfully applied in several case studies for analyzing embedded defect or passive voltage contrast (PVC) fault isolation.