{"title":"A Survey on Reliability Assessment of Power Modules","authors":"Shima Khoshzaman, I. Hahn","doi":"10.1109/SPEEDAM.2018.8445368","DOIUrl":null,"url":null,"abstract":"The continuous increase in the requirements of power modules in industrial applications is the motivation to draw more attention towards reliability and the state-of-health assessment of them. The basics of conventional module packaging technology containing base plate, bond wires and solder layers and its limitations are reviewed in this paper. Typical end-of-life package-related failures are discussed. In addition, accelerated aging tests and common lifetime estimation models are reviewed.","PeriodicalId":117883,"journal":{"name":"2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM)","volume":"157 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPEEDAM.2018.8445368","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The continuous increase in the requirements of power modules in industrial applications is the motivation to draw more attention towards reliability and the state-of-health assessment of them. The basics of conventional module packaging technology containing base plate, bond wires and solder layers and its limitations are reviewed in this paper. Typical end-of-life package-related failures are discussed. In addition, accelerated aging tests and common lifetime estimation models are reviewed.
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