Reliability of Gate Metallization in Power GaAs MESFETs

K. Katsukawa, Y. Kose, M. Kanamori, S. Sando
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引用次数: 9

Abstract

Failure modes have been studied on 0.5 ¿m gate power GaAs MESFETs with Al, Ti/Al and Ti/Al/Ti gate metallization, respectively. It has been found that the dominant failure modes are gate metal disconnection for Al gate, catastrophic burn out for the Ti/Al gate and gate breakdown voltage degradation for the Ti/Al/Ti gate under D.C. operational life tests. The degradation mechanisms have been clarified using SEM, microprobe-AES and SIMS. It is shown that Ti/Al, gate is the most reliable among these three kinds of FETS.
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功率GaAs mesfet栅极金属化的可靠性
分别研究了Al、Ti/Al和Ti/Al/Ti栅极金属化的0.5¿m栅极功率GaAs mesfet的失效模式。在直流工作寿命试验中发现,Al栅极的主要失效模式是栅极金属断开、Ti/Al栅极的灾难性烧毁和Ti/Al/Ti栅极击穿电压下降。利用SEM、aes和SIMS等手段对其降解机理进行了研究。结果表明,在这三种fet中,Ti/Al栅极是最可靠的。
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