Air cooling augmentation in an array of heated modules by horizontal semicircular cylindrical shells as cross flow barriers

S. Bhatta, T. Seetharam
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Abstract

A three dimensional study of air cooling from an array of heated blocks in a rectangular channel for a range of Reynolds number is presented. Heated blocks represent electronic modules mounted on horizontal circuit boards. Numerically obtained average heat transfer coefficients for the top surface of the heated modules are compared with experimentally obtained values, and it is found that there is a good agreement between the two at low Reynolds numbers. Further, circular cylinders, semi-circular cylinders, and semicircular cylindrical shells with length equal to the width of the channel are introduced as flow barriers in the domain separately to study the influence on heat transfer and pressure drop. These horizontal cylinders over each row of modules in cross flow augment heat transfer from the heated modules considerably. The heat transfer enhancement is found to be more dependent on the vertical position of the cylinders with respect to the modules than on the horizontal position. Air cooling is predicted to be augmented from the modules by shifting the cylinders closer to the heated modules up to a certain limiting distance, and beyond which the heat transfer decreases. Semicircular cylindrical shells prove more beneficial than any of the other two barriers for heat transfer enhancement from the modules. It is observed that the semicircular shells in cross flow result in lesser pressure drop when compared to semicircular cylinders, though the former produces maximum heat transfer from the modules.
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通过水平半圆形圆柱壳作为横流屏障,在加热模块阵列中增加空气冷却
在一定雷诺数范围内,对矩形通道内的加热块阵列进行了空气冷却的三维研究。加热块代表安装在水平电路板上的电子模块。将数值计算得到的受热模块顶面平均换热系数与实验计算得到的值进行了比较,发现在低雷诺数时两者吻合较好。在此基础上,分别引入长度等于通道宽度的圆柱、半圆圆柱和半圆圆柱壳作为流动屏障,研究其对换热和压降的影响。横流中每排模块上的这些水平圆柱体大大增加了被加热模块的传热。研究发现,相对于模块而言,传热增强更多地取决于圆柱体的垂直位置,而不是水平位置。预计通过将气缸移近加热模块达到一定的限制距离,可以增强模块的空气冷却,超过该距离,传热就会减少。半圆圆柱壳被证明比其他两种屏障更有利于增强模块的传热。观察到,与半圆圆柱体相比,半圆壳在横向流动中产生的压降较小,尽管前者从模块中产生的热量最大。
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