Y. Horikoshi, T. Hashitani, M. Kutami, K. Yazaki, Y. Ando
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引用次数: 1
Abstract
This paper assesses the life-cycle of packaging materials designed to protect large-scale integration devices from shock and static electricity when they are transported from semiconductor factories to printed-circuit-board factories. Carbon dioxide (CO2) emitted during production and incineration was reduced by 11% when embossed plastic tape packaging made from non-renewable sources was replaced by material made from bio-based polymer
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