{"title":"A Highly-Integrated 20-300V 0.5W Active-Clamp Flyback DCDC Converter with 76.7% Peak Efficiency","authors":"Christoph Rindfleisch, Jens Otten, B. Wicht","doi":"10.1109/CICC53496.2022.9772834","DOIUrl":null,"url":null,"abstract":"There is a growing need for compact and energy efficient high-voltage (HV) DCDC converters with input voltages >100V for low-power applications up to 500mW. This includes loT and smart-home, supplied from the ac mains, as well as auxiliary supplies for power converters in electrical vehicles and in the field of renewable energy that operate from HV DC-link. Discrete state-of-the-art power supplies are not efficient at light loads below 500mW and are relatively large in size, Fig. 1. They typically use a passive-clamp flyback (PCF) topology (Fig. 1 bottom right) with large external components, such as power switches (QM), HV capacitors $(Cc)$, the output diode $\\mathrm{D}_{\\text{out}}$, and a transformer $\\top$ with up to several millihenries of inductance. The passive clamp topology also suffers from losses due to the leakage inductance $L_{\\text{lk}}$ and the hard switching of $\\mathrm{Q}_{\\mathrm{M}}$. Non-isolated HV DCDC converters with dedicated power topologies [1] achieve good power densities but are not suitable for applications that require galvanic HV isolation. Active clamp flyback (ACF) converters (Fig. 1 bottom left) allow for galvanic isolation while keeping switching losses low. However, ACF designs [2], [3] are usually optimized for high output power and still require large external components. Further, their complex control limits the light-load efficiency. This paper presents a low-power-optimized ACF IC that benefits from integration in a 180nm HV SOI technology. It offers a fully integrated power stage and provides a robust and time-precise control at faster switching speed and more compact size. This way, high light-load efficiency and good power density are achieved.","PeriodicalId":415990,"journal":{"name":"2022 IEEE Custom Integrated Circuits Conference (CICC)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Custom Integrated Circuits Conference (CICC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC53496.2022.9772834","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
There is a growing need for compact and energy efficient high-voltage (HV) DCDC converters with input voltages >100V for low-power applications up to 500mW. This includes loT and smart-home, supplied from the ac mains, as well as auxiliary supplies for power converters in electrical vehicles and in the field of renewable energy that operate from HV DC-link. Discrete state-of-the-art power supplies are not efficient at light loads below 500mW and are relatively large in size, Fig. 1. They typically use a passive-clamp flyback (PCF) topology (Fig. 1 bottom right) with large external components, such as power switches (QM), HV capacitors $(Cc)$, the output diode $\mathrm{D}_{\text{out}}$, and a transformer $\top$ with up to several millihenries of inductance. The passive clamp topology also suffers from losses due to the leakage inductance $L_{\text{lk}}$ and the hard switching of $\mathrm{Q}_{\mathrm{M}}$. Non-isolated HV DCDC converters with dedicated power topologies [1] achieve good power densities but are not suitable for applications that require galvanic HV isolation. Active clamp flyback (ACF) converters (Fig. 1 bottom left) allow for galvanic isolation while keeping switching losses low. However, ACF designs [2], [3] are usually optimized for high output power and still require large external components. Further, their complex control limits the light-load efficiency. This paper presents a low-power-optimized ACF IC that benefits from integration in a 180nm HV SOI technology. It offers a fully integrated power stage and provides a robust and time-precise control at faster switching speed and more compact size. This way, high light-load efficiency and good power density are achieved.