{"title":"Liquid flow-through cooling for avionics applications","authors":"M. Barwick, M. Midkiff, D. Seals","doi":"10.1109/NAECON.1991.165750","DOIUrl":null,"url":null,"abstract":"An avionics cooling system has been developed that circulates fluid through the structural frame of its SEM-E modules. The liquid flow-through (LFT) module frame is only 100 mils thick, yet is capable of maintaining low junction and surface temperatures for modules dissipating in excess of 200 W. The module form/factor is compatible with existing SEM-E circuit board formats and connectors and features toolless, dripless, quick-disconnect removal and insertion. A prototype avionics cooling system has been developed consisting of 52 LFT modules and a parallel feed rack/manifold. Both the module and the system have demonstrated outstanding cooling efficiency, and good reliability under preliminary shock and vibration testing. Cooling tests show a significant improvement over edge-conduction cooling. Thermal comparison tests indicate a 20 degrees C improvement in frame surface temperature over an edge-conduction-cooled 50 W module.<<ETX>>","PeriodicalId":247766,"journal":{"name":"Proceedings of the IEEE 1991 National Aerospace and Electronics Conference NAECON 1991","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 1991 National Aerospace and Electronics Conference NAECON 1991","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NAECON.1991.165750","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
An avionics cooling system has been developed that circulates fluid through the structural frame of its SEM-E modules. The liquid flow-through (LFT) module frame is only 100 mils thick, yet is capable of maintaining low junction and surface temperatures for modules dissipating in excess of 200 W. The module form/factor is compatible with existing SEM-E circuit board formats and connectors and features toolless, dripless, quick-disconnect removal and insertion. A prototype avionics cooling system has been developed consisting of 52 LFT modules and a parallel feed rack/manifold. Both the module and the system have demonstrated outstanding cooling efficiency, and good reliability under preliminary shock and vibration testing. Cooling tests show a significant improvement over edge-conduction cooling. Thermal comparison tests indicate a 20 degrees C improvement in frame surface temperature over an edge-conduction-cooled 50 W module.<>
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