Characterization of CVD diamond film and diamond-tip field emitter array for FED applications

B. Ju, Seong-jin Kim, Yun‐Hi Lee, B. S. Park, Y. Baik, Sungkyoo Lim, M. Oh
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Abstract

Diamond-tip field emitter arrays and a flat diamond films were fabricated and characterized. The tip radius of 300 A was obtained by using a silicon mold formed by orientation dependent etching (ODE). The fabricated diamond-tip array was identified as diamond from Raman spectroscopy. Emission current of 200 /spl mu/A and threshold voltage of 600 V were obtained for the diamond-tip field emitter arrays from the current-voltage measurement. Emission current of 6 /spl mu/A and threshold voltage of 800 V were obtained from the flat diamond film deposited under the same condition as diamond-tip field emitter arrays. The diamond-tip field emitter arrays were shown to have better electrical characteristics than the flat diamond films.
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用于FED的CVD金刚石薄膜和金刚石尖端场发射极阵列的表征
制备了金刚石尖端场发射极阵列和金刚石薄膜,并对其进行了表征。采用取向依赖蚀刻法(ODE)制备硅模,获得了300 A的尖端半径。利用拉曼光谱对制备的金刚石尖阵列进行了鉴定。通过电流-电压测量得到了金刚石尖场发射极阵列的发射电流为200 /spl mu/A,阈值电压为600 V。在与金刚石尖端场发射极阵列相同的条件下沉积的平面金刚石薄膜获得了6 /spl mu/A的发射电流和800 V的阈值电压。金刚石尖端场发射极阵列的电学特性优于扁平金刚石薄膜。
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