{"title":"A multilayered package technology for MMICs","authors":"M. Ida, T. Nishikawa","doi":"10.1109/APS.1993.385177","DOIUrl":null,"url":null,"abstract":"Three packaging technologies are introduced. An MCF (multilayer ceramic frame) single-cavity package shows high performance to Ka-band. An advanced MCF multiple-cavity package exhibits high performance of 26 GHz receiver. A microwave MCM (multichip module) made of BAS substrate demonstrates high performance of the L-band amplifier.<<ETX>>","PeriodicalId":138141,"journal":{"name":"Proceedings of IEEE Antennas and Propagation Society International Symposium","volume":"72 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Antennas and Propagation Society International Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APS.1993.385177","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
Three packaging technologies are introduced. An MCF (multilayer ceramic frame) single-cavity package shows high performance to Ka-band. An advanced MCF multiple-cavity package exhibits high performance of 26 GHz receiver. A microwave MCM (multichip module) made of BAS substrate demonstrates high performance of the L-band amplifier.<>
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