{"title":"High Carrier Mobility Sn-Doped Ge Thin-Films (< 50 nm) on Insulator by Interface-Modulated Solid-Phase Crystallization at Low-Temperature","authors":"X. Gong, C. Xu, T. Sadoh","doi":"10.7567/ssdm.2019.f-6-02","DOIUrl":null,"url":null,"abstract":"Effects of introduction of a-Si under-layers on solid-phase crystallization of Sn-doped Ge on insulator have been investigated. By introduction of a-Si under-layers, energy barrier for carriers at grain-boundaries is significantly decreased. As a result, high carrier mobility of 200−300 cm 2 /Vs is realized for thin GeSn films (30−50 nm) grown with a-Si under-layers. This mobility is the highest among ever reported data for Ge and GeSn thin-films (≤50 nm) on insulator grown at low-temperatures (≤500°C).","PeriodicalId":117226,"journal":{"name":"Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-09-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.7567/ssdm.2019.f-6-02","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Effects of introduction of a-Si under-layers on solid-phase crystallization of Sn-doped Ge on insulator have been investigated. By introduction of a-Si under-layers, energy barrier for carriers at grain-boundaries is significantly decreased. As a result, high carrier mobility of 200−300 cm 2 /Vs is realized for thin GeSn films (30−50 nm) grown with a-Si under-layers. This mobility is the highest among ever reported data for Ge and GeSn thin-films (≤50 nm) on insulator grown at low-temperatures (≤500°C).