Two-phase mini-thermosyphon electronics cooling, Part 4: Application to 2U servers

N. Lamaison, J. Marcinichen, C. L. Ong, J. Thome
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引用次数: 14

Abstract

This paper is the fourth part of the present study on two-phase mini-thermosyphon cooling. As mentioned in the first three parts, gravity-driven cooling systems using microchannel flow boiling can become a long-term scalable solution for cooling of datacenter servers. Indeed, the enhancement of thermal performance and the drastic reduction of power consumption together with the possibility of energy reuse and the inherent passive nature of the system offer a wide range of solutions to thermal designers. While Part 1 presented the first-of-a-kind low-height microchannel two-phase thermosyphon test results and Parts 2 and 3 showed the system scale steady and dynamic modeling and simulation results associated with this design using our inhouse simulator, Part 4 deals here with an end-user application, i.e. the cooling of a 2U server. The dynamic code of Part 3 is used to model the behavior of a mini-thermosyphon that would fit within the height of a 2U server (8.9cm high), while respecting the other geometric constraints (positions of the processors, distance of the processors to the back of the blade, etc.). Thus, the simulated system consists of two parallel multi-microchannel evaporator cold plates on the top of two chips of about 11cm2, a riser, a common water-cooled micro-condenser at the back of the blade, a liquid accumulator and a downcomer (including the piping branches to/from the two cold plates). First, an analysis of the steady-state operation highlights multiple solutions from which one is stable and one is unstable. Then, the influences of few parameters such as refrigerants, piping diameters, water coolant inlet temperature and flow rates, filling ratio and heat flux are evaluated. Simulations with unbalanced heat loads on the two chips being cooled in parallel then show the desirable flow distribution obtained in such gravity-driven systems. Finally, temporal heat load and water coolant flow rate disturbances are simulated and discussed. Noting all of these numerous influences on optimal mini-thermosyphon operation, the need for a accurate and detailed simulation code, benchmarked versus actual system tests, is seen to be imperative for attaining a good, reliable, robust design.
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两相微型热虹吸电子冷却,第4部分:2U服务器的应用
本文是两相微型热虹吸冷却研究的第四部分。正如前三个部分所提到的,使用微通道流沸腾的重力驱动冷却系统可以成为数据中心服务器冷却的长期可扩展解决方案。事实上,热性能的增强和功耗的大幅降低,加上能源再利用的可能性和系统固有的被动特性,为热设计师提供了广泛的解决方案。第1部分展示了首个低高度微通道两相热虹吸测试结果,第2部分和第3部分展示了使用我们的内部模拟器与此设计相关的系统规模稳态和动态建模和仿真结果,第4部分将讨论最终用户应用程序,即2U服务器的冷却。第3部分的动态代码用于模拟迷你热虹吸的行为,该行为将适合2U服务器的高度(8.9cm高),同时尊重其他几何约束(处理器的位置,处理器到刀片背面的距离等)。因此,模拟系统由位于两个约11cm2的芯片顶部的两个并联多微通道蒸发器冷板、一个立管、叶片后部的普通水冷式微冷凝器、一个蓄液器和一个降水管(包括两个冷板之间的管道分支)组成。首先,对稳态运行的分析突出了多个解决方案,其中一个是稳定的,另一个是不稳定的。然后,对制冷剂、管道直径、水冷剂进口温度和流量、填充比和热流密度等参数的影响进行了分析。然后在两个芯片并行冷却的不平衡热负荷的模拟中,得到了这种重力驱动系统中理想的流动分布。最后,对时间热负荷和水冷剂流量扰动进行了模拟和讨论。注意到所有这些对最佳迷你热虹吸操作的众多影响,需要准确和详细的模拟代码,基准测试与实际系统测试,对于获得良好,可靠,稳健的设计是必不可少的。
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