W. Prost, U. Auer, F. Tegude, C. Pacha, K. Goser, R. Duschl, K. Eberl, O. Schmidt
{"title":"Tunnelling diode technology","authors":"W. Prost, U. Auer, F. Tegude, C. Pacha, K. Goser, R. Duschl, K. Eberl, O. Schmidt","doi":"10.1109/ISMVL.2001.924554","DOIUrl":null,"url":null,"abstract":"The technology of quantum tunnelling devices, namely III/V double barrier Resonant Tunnelling Diodes (RTD) and Si/SiGe Interband Tunnelling Diodes (ITD), is studied for logic circuit applications. The homogeneity and reproducibility of MBE grown InP-based RTD devices with mesa technology is presented. Si/SiGe ITD have been grown by MBE on high resistivity (n-) Silicon substrates. A novel self-aligned diode is processed using optical lithography and dopant-selective wet chemical etching. Comparing RTD and ITD data the differences are due to the vertical spacing of the doped layers within the device. A nanoelectronic circuit architecture based on an improved MOBILE threshold logic gate is used. SPICE simulations are carried-out in order to evaluate tolerable clock and supply voltage fluctuations in comparison to device fluctuations.","PeriodicalId":297353,"journal":{"name":"Proceedings 31st IEEE International Symposium on Multiple-Valued Logic","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 31st IEEE International Symposium on Multiple-Valued Logic","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISMVL.2001.924554","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
The technology of quantum tunnelling devices, namely III/V double barrier Resonant Tunnelling Diodes (RTD) and Si/SiGe Interband Tunnelling Diodes (ITD), is studied for logic circuit applications. The homogeneity and reproducibility of MBE grown InP-based RTD devices with mesa technology is presented. Si/SiGe ITD have been grown by MBE on high resistivity (n-) Silicon substrates. A novel self-aligned diode is processed using optical lithography and dopant-selective wet chemical etching. Comparing RTD and ITD data the differences are due to the vertical spacing of the doped layers within the device. A nanoelectronic circuit architecture based on an improved MOBILE threshold logic gate is used. SPICE simulations are carried-out in order to evaluate tolerable clock and supply voltage fluctuations in comparison to device fluctuations.