{"title":"Survey of non-destructive inspection methods for solder joint integrity","authors":"D. O'Conchuir, J. Mccurdy, V. Casey","doi":"10.1109/NAECON.1991.165925","DOIUrl":null,"url":null,"abstract":"Non-destructive techniques for solder joint inspection are surveyed. Both commercially available systems and methods still under research are described. The techniques are divided into visual, thermal, X-ray, and acoustic inspection. The mode of operation for each method is described and its good and bad points are looked at. It is seen that each method is suited to a particular inspection need, and no one technique fulfils all the requirements for a perfect system.<<ETX>>","PeriodicalId":247766,"journal":{"name":"Proceedings of the IEEE 1991 National Aerospace and Electronics Conference NAECON 1991","volume":" 16","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 1991 National Aerospace and Electronics Conference NAECON 1991","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NAECON.1991.165925","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 15
Abstract
Non-destructive techniques for solder joint inspection are surveyed. Both commercially available systems and methods still under research are described. The techniques are divided into visual, thermal, X-ray, and acoustic inspection. The mode of operation for each method is described and its good and bad points are looked at. It is seen that each method is suited to a particular inspection need, and no one technique fulfils all the requirements for a perfect system.<>
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